Features Of In Line Sputtering Systems

May 4th, 2011 |

The most common configuration, and less complex is that the platforms and horizontal cathode cathodes in the top and bottom substrates in the direction of spray. In this way, gravity is usually the only thing the media on platforms, and the only thing that the pallets in the transport mechanism, which can only be strings along the side rails of the empty room .

The horizontal arrangement can also be made with cathodes at the bottom and the substrates on top of a spray to management, but obviously the more complicated tools, which now requires mechanical means to hold substrates place so they do not fall. For coating one side, it’s not a very common configuration, but is sometimes made of double layer coating of cathodes above and below the pallets. Pallets in this case have openings suitable for holding the substrate so that the bottom can receive up spray coating of the cathode bottom along the top down spray coating of the cathode above.

But the scale is the downside of particulates. In sputter-down mode particles, which are easy to create a room to get off and get embedded in the surface film and it’s definitely happening. Deposition are a bit ‘self-contamination of material for other platforms beyond. What is more maintenance to keep things clean. In sputter up, these particles do not reach the platforms, but may settle for goals and to get re-sputtered.

So for a better environment of particles that is also a chance the page vertically spraying. The two cathodes and pallets are vertical and lateral filing. Tools and transportation system much more complicated to keep the substrates on the pallet and the handle of the paddle in that direction, but the particles are much less likely to fall into either the cathode or the substrate.

Each of these configurations, all kinds of cathodes can be used, magnetron is usually the most popular, is planar or flush. And the power can be any of several available, such as RF, MFAC, DC or pulsed DC, the desired application. voluntary steps such as sputtering etch sources, heat or ions can also be accommodated, and a full range of test equipment are available in conductive metal coatings, insulators, optical coatings or other sputter applications.